Extruded semi-rigid material with the unique "ping-pong" memory effect — engineered for shoe toe-puffs and counters with PU adhesive and dual backer construction for superior bonding and structural performance.
Extruded Ni/PU composite with the signature "ping-pong" elastic memory — ensuring toe boxes and heel counters snap back to shape after compression, maintaining the shoe's form over its full lifecycle.
INTELON is a semi-rigid extruded material purpose-built for toe-puff and counter applications in footwear manufacturing. It features a PU adhesive system with two backers for reliable bonding to uppers under heat and pressure. Available in TMS1 and TMS2 grades across five thickness profiles — from 0.50 mm up to 1.30 mm — to suit lightweight athletic and heavy-duty safety footwear alike.
| INTELON Grade | Thickness* (mm) | Tolerance | Grade |
|---|---|---|---|
| 472 – TMS1 | 0.50 – 0.60 | ± 0.05 mm | TMS1 |
| 473 – TMS1 | 0.55 – 0.65 | ± 0.05 mm | TMS1 |
| 475 – TMS1 | 0.65 – 0.75 | ± 0.05 mm | TMS1 |
| 477 – TMS1 | 0.85 – 0.95 | ± 0.05 mm | TMS1 |
| 479 – TMS1 | 1.10 – 1.20 | ± 0.05 mm | TMS1 |
| INTELON Grade | Thickness* (mm) | Tolerance | Grade |
|---|---|---|---|
| 473 – TMS2 | 0.65 – 0.75 | ± 0.05 mm | ✓ TMS2 |
| 475 – TMS2 | 0.75 – 0.85 | ± 0.05 mm | ✓ TMS2 |
| 477 – TMS2 | 0.95 – 1.05 | ± 0.05 mm | ✓ TMS2 |
| 479 – TMS2 | 1.20 – 1.30 | ± 0.05 mm | ✓ TMS2 |

The toe puff is applied using a special pneumatic pressing machine equipped with a heated curved plate, timer, and thermostat. The curved plate conforms the INTELON to the last profile while the heat activates the PU adhesive.
Working conditions should be set to a press temperature between 130°C and 150°C. Contact time ranges from 6 to 12 seconds, increasing with the thickness of the article being processed. The effective interface temperature at the bond line must reach a minimum of 100°C to achieve full adhesive activation.
We recommend carrying out a preliminary bonding test before full production, as application conditions may vary depending on the characteristics of the upper material — particularly its thickness, surface texture, and thermal conductivity.
There is no binding time or constraint on the lasting period after application — bonded components can proceed directly to the next production step.
Custom thickness profiles, TMS1 and TMS2 grades, slit rolls or die-cut blanks — all available on request. Our team will help you select the right INTELON specification for your upper material and production process.